Laser unit for direct machining of copper on PCB (LPKF ProtoLaser S4 with accessories)
- Laser is controlled by PC with SW, working with formats Extended Gerber 274-X, Excellon, HPGL, ODB
- The laser unit is controlled by a PC with SW
- Machinable area 22.9 cm x 30.5 x 1.0 cm
- Laser beam diameter up to 0.023 mm
- The ablation rate of 0.018 mm of the copper layer is 650 mm / s
- The smallest possible final joint thickness of 0.075 mm on a substrate of 0.018 mm Cu
- Minimum insulation gap 0.025 mm on the substrate 0.018 mm Cu
- The measuring camera is part of the machining head
- Optical recognition of reference points on the PCB
- Vacuum table
- Suction for vacuum table
- Extraction of vapors from machining
- Compressed air source
- Particulate filter
- Air dryer
Plating line for the formation of plated holes on the PCB by electrochemical means (LPKF Contact S4 with accessories)
- Tanks for the plating process
- The plating line enables cleaning of holes, activation of PCBs, plating of holes, tinning of the resulting PCBs
- Plating tolerance up to 0.002 mm
- The size of the processed material (including the technological environment) is 22 cm x 30 cm
- The plating line is controlled by a computer with SW, which takes care of the course of the process and at the same time provides guides (instructions) for operating the line
CNC milling machine for drilling and mechanical machining of printed circuit boards (LPKF ProtoMat S63 with accessories)
- The milling cutter enables contour milling, drilling of holes, mechanical milling of the motif into copper on PCB and metal machining, min. aluminum alloys and brass
- The cutter is controlled by a PC with SW, working with formats Extended Gerber 274-X, Excellon, HPGL, ODB
- Number of computer-controlled axes 3 - at least in 2.5D machining mode
- Machinable dimensions 22.9 cm x 30.5 cm with a height of 2.2 cm
- Resolution in position 0.0005 mm with repeatability 0.001 mm
- X / Y feed speed 15 cm / s
- Machining head speed of at least 60,000 rpm, controlled by software
- Collet size 3.175 mm (1/8 ")
- Ability to drill min. 120 holes per minute (excluding feed)
- Automatic tool change, with magazine for at least 15 tools
- Measuring camera included in the machining head
- Automatic adjustment of the width of the milled line (depth setting for V cutters)
- Optical recognition of reference points on the PCB
- Solder paste application unit
- Closed system with minimal dust (covered machining space)
- Vacuum table
- Dust extraction
- Compressed air source for dust extraction from machining
- Particulate filter
- Air dryer
- Laminating press for lamination of multilayer printed circuit boards
