LPKF ProtoLaser S4 with accessories
Laser unit for direct processing of copper on PCB
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The laser is controlled by PC software, working with Extended Gerber 274-X, Excellon, HPGL, ODB
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The laser unit is controlled by a PC software
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Operating area is 22.9 cm x 30.5 cm x 1.0 cm
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Laser beam diameter up to 0.023 mm
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Ablation rate of 0.018 mm copper layer is 650 mm / s
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The smallest possible PCB thickness is 0.075 mm on a 0.018 mm Cu substrate
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The minimum insulating gap is 0.025 mm on 0.018 mm Cu substrate
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The camera is part of the cutting head
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Optical recognition of reference points on PCB
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Vacuum table
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Suction for a vacuum table
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Vapour extraction during machining
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Compressed air source
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Particle filter
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Air dryer
LPKF Contact S4 with accessories
Plating line for making PCB holes on PCB
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A plating line for making plated holes on PCB using the electrochemical approach
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Tanks for the plating process
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Plating line allows cleaning of holes, PCB activation, plating of holes, tinning of resulting PCBs
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Metal coating tolerance up to 0.002 mm
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The size of the processed material (including the surrounding area) is 22 cm x 30 cm
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The plating line is controlled by computer software that takes care of the progress of the process and provides a guide (instructions) for the operation of the line
LPKF ProtoMat S63 with accessories
CNC cutter for drilling and mechanical machining of printed circuit boards
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The milling cutter mills/cuts edges, bores holes, mechanically mills motifs into copper on the PCB. It can work with metals such as aluminum alloys and brass
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The cutter is controlled by PC software, working with Extended Gerber 274-X, Excellon, HPGL, ODB
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Number of computer-controlled axes is 3 - at least in 2.5D machining mode
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Machinable dimensions are 22.9 cm x 30.5 cm with height 2.2 cm
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Resolution in position 0.0005 mm with repeatability 0.001 mm
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X / Y feed rate 15 cm / s
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Machining head speed at least 60000 rpm, controlled by software
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Collet size 3.175 mm (1/8 ")
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Ability to drill min. 120 holes per minute (without counting feed)
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Automatic tool change, with a stack of at least 15 tools
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Measuring camera part of the cutting head
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Automatically adjust the width of the milled line (V-cutter depth setting)
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Optical recognition of reference points on PCB
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A unit for applying a solder paste
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Closed system with minimal dustiness (covered machining area)
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Vacuum table
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Dust extraction
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Pressure air source for dust extraction during machining
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Particle filter
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Air Dryer
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Laminating press for lamination of multilayer printed circuit boards