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LPKF ProtoLaser S4 with accessories

Laser unit for direct processing of copper on PCB

  •  The laser is controlled by PC software, working with Extended Gerber 274-X, Excellon, HPGL, ODB

  •  The laser unit is controlled by a PC software

  •  Operating area is 22.9 cm x 30.5 cm x 1.0 cm

  • Laser beam diameter up to 0.023 mm

  •  Ablation rate of 0.018 mm copper layer is 650 mm / s

  •  The smallest possible PCB thickness is 0.075 mm on a 0.018 mm Cu substrate

  •  The minimum insulating gap is 0.025 mm on 0.018 mm Cu substrate

  •  The camera is part of the cutting head

  •  Optical recognition of reference points on PCB

  •  Vacuum table

  •  Suction for a vacuum table

  •  Vapour extraction during machining

  •  Compressed air source

  •  Particle filter

  •  Air dryer


LPKF Contact S4 with accessories

Plating line for making PCB holes on PCB

  •  A plating line for making plated holes on PCB using the electrochemical approach

  •  Tanks for the plating process

  •  Plating line allows cleaning of holes, PCB activation, plating of holes, tinning of resulting PCBs

  •  Metal coating tolerance up to 0.002 mm

  •  The size of the processed material (including the surrounding area) is 22 cm x 30 cm

  •  The plating line is controlled by computer software that takes care of the progress of the process and provides a guide (instructions) for the operation of the line


LPKF ProtoMat S63 with accessories

CNC cutter for drilling and mechanical machining of printed circuit boards

  • The milling cutter mills/cuts edges, bores holes, mechanically mills motifs into copper on the PCB. It can work with metals such as aluminum alloys and brass

  • The cutter is controlled by PC software, working with Extended Gerber 274-X, Excellon, HPGL, ODB

  • Number of computer-controlled axes is 3 - at least in 2.5D machining mode

  • Machinable dimensions are 22.9 cm x 30.5 cm with height 2.2 cm

  • Resolution in position 0.0005 mm with repeatability 0.001 mm

  • X / Y feed rate 15 cm / s

  • Machining head speed at least 60000 rpm, controlled by software

  • Collet size 3.175 mm (1/8 ")

  • Ability to drill min. 120 holes per minute (without counting feed)

  • Automatic tool change, with a stack of at least 15 tools

  • Measuring camera part of the cutting head

  • Automatically adjust the width of the milled line (V-cutter depth setting)

  • Optical recognition of reference points on PCB

  • A unit for applying a solder paste

  • Closed system with minimal dustiness (covered machining area)

  • Vacuum table

  • Dust extraction

  • Pressure air source for dust extraction during machining

  • Particle filter

  • Air Dryer

  • Laminating press for lamination of multilayer printed circuit boards